MIL-DTL-23971/4A
REQUIREMENTS:
Design and construction: See figure 1.
Terminals: Solder leads.
Material: Copper or Iron-nickel alloy in accordance with SAE-AMS-I-23011, "Iron-Nickel Alloys for Sealing to
Glasses and Ceramics", (KOVAR). Nickel is to be used only if specification cannot be met using alternate
material means.
Finish: Tin plated per ASTM-B545, "Standard Specification for Electrodeposited Coatings of Tin", type 1, 0.0005
inch thick minimum, dull finish or gold-plated in accordance with SAE-AMS-2422 "Plating, Gold,
Electronic and Electrical Applications" and/or ASTM-B488 "Gold for Engineering Uses, Electrodeposited
Coatings of".
Ambient temperature:
-54° to +110°C.
Operating
-62° to +125°C.
Storage
Electrical performance characteristics:
Impedance: 50 ohms.
Frequency range: 225 to 400 GHz.
Coupling. 3 dB +.2, -0.
VSWR: 1.2:1 maximum.
Insertion loss: 0.25 dB maximum.
Isolation: 20 dB minimum.
Phase balance: 90° ±1.5°.
Amplitude balance. 0.4 dB.
Power level: 100 W average, 200 W peak.
Part number: M23971/4-01.
Custodians:
Preparing activity:
Army - CR
DLA - CC
Navy - EC
Air Force - 11
(Project 5985-1227-04)
DLA - CC
Review activities:
Navy - AS, MC, OS
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