MIL-DTL-3970F
4.7.7 Shock (specified pulse) (see 3.10). Assemblies shall be tested in accordance with MIL-STD-202, method
213. The following details shall apply:
a.
Mounting: Rigidly mounted to test platform.
b.
Test condition letter: G.
c. Measurements after shock: VSWR, insertion loss, and pressurization shall be measured as specified in
4.7.8 Power handling capability (when specified, see 3.1) (see 3.11). Assemblies shall be subjected to the radio
frequency (RF) power level specified (see 3.1) at the frequency, simulated altitude, and temperature specified (see
3.1). Power shall be maintained for 1 hour after the temperature of the assembly has reached equilibrium
(equilibrium has been attained when the assembly temperature does not change more than 5°C within a 15-minute
period). During the test the assembly shall be terminated in a matched load (1.1 VSWR maximum). After the test
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or
purchase order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel,
these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements.
Packaging requirements are maintained by the Inventory Control Point's packaging activities within the Military
Service or Defense Agency, or within the military service's system commands. Packaging data retrieval is available
from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by
contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.)
6.1 Intended use. Rigid waveguide assemblies are intended for use as bends, corners, and twists in rigid
waveguide transmission lines to facilitate permanent direction or field orientation changes in the transmission line.
The waveguide assemblies herein specified are military unique because they must function within and withstand for
prolonged periods worldwide military unique environments. Commercial electronic components are not designed to
withstand such extreme environmental conditions. Military uniqueness is also due to the costs required to change
fielded systems to accommodate other than these standard military components.
6.2 Ordering data. Acquisition documents should specify the following:
a.
Title, number, and date of this specification.
b.
Title, number, and date of applicable specification sheet and the complete PIN.
c.
Packaging (see 5.1).
d.
If special or other identification marking is required.
6.3 First article inspection. Information pertaining to first article inspection of products covered by this specification
should be obtained from the acquiring activity for the specific contracts involved (see 3.2).
6.3.1 Alternate (equivalent) test methods. The use of equivalent test methods is allowed (see 4.4.1). Results for
alternate test methods must be submitted to the acquiring activity for prior approval. The manufacturer must have
conducted both test methods and have submitted complete test data to the acquiring activity verifying the equivalency
of each alternate test method proposed. For proposed alternate test methods, test method comparative error
analysis must be made available for examination by the acquiring activity.
6.4 Definitions. For the purpose of this specification, the following definition applies.
6.4.1 Dissimilar metals. Dissimilar metals are defined in MIL-STD-889.
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