MIL-DTL-55288E
6.10 DEFINITIONS
6.10.1 Branching. Branching is a connected arrangement of filaments (hyphae) formed by shoots or secondary
stems growing from the main stem or filament (hypha).
6.10.2 Growth colonization. Growth colonization is a mass of individual plants, generally of one species, living
together; or a group of hyphae which is formed from one spore or cell and may be one individual plant. Colonization
which completely covers the surface of the nutrient material constitutes abundant growth.
6.10.3 Microbial growth. Microbial growth is the growth of very minute organisms. Such organisms when present
in large numbers may provide a colony visible to the naked eye.
6.10.4 Sporulation. Sporulation is formation of minute unicellular reproductive or dormant bodies, called spores.
6.10.5 Tubular germination. Tubular germination is partial growth by the production of hyphae, which are tubular
shaped fungal filaments. Tubular germination constitutes restricted individual spore growth not proceeding to
colonization.
6.11 Matching Unit Base Alignment Cavity. This cavity (see appendix) is a recent development of the U.S. Army
Communication - Electronics Command and is considered to be a significant improvement in MX-6707/VRC
alignment and test method.
6.12 Subject term (keyword) listing.
Aerial
Vehicular antenna
Whip antenna
6.13 Environmentally preferable material. Environmentally preferable materials should be used to the maximum
extent possible to meet the requirements of this specification. As of the dating of this document, the U.S.
Environmentally Protection Agency (EPA) is focusing efforts on reducing 31 priority chemicals. The list of chemicals
and additional information is available on their website at https://www.epa.gov/osw/hazard/wastemin/priority.htm.
Included in the list of 31 priority chemicals are cadmium, lead, and mercury. Use of the materials on the list should
be minimized or eliminated unless needed to meet the requirements specified herein (see section 3).
6.14 Tin whisker growth (see 3.13.1). The use of alloys with tin content greater than 97 percent, by mass, may
exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after
manufacture and can develop under typical operating conditions, on products that use such materials. Conformal
coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent
lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to
ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
6.15 Changes from previous issue. The margins of this specification are marked with vertical lines to indicate
where changes from the previous revision were made. This was done as a convenience only and the Government
assumes no liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to
evaluate the requirements of this document based on the entire content irrespective of the marginal notations and
relationship to the last previous issue.
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