MIL-HDBK-660B
FIGURE 39. Brazing waveguide and flange-butt design.
5.8.2 Assembly. Parts should be assembled and a mandrel, of sufficient size to ensure precise alignment of waveguide to flange, should be inserted to the joint area and the flange inert gas-tack welded on two opposing corners of the waveguide prior to dip brazing. Heat resistant alloy wire, rod shims, jigs, clamps, or perforated baskets should be used to assemble the transmission line components for dip brazing.
5.8.2.1 Final cleaning. Parts should be cleaned with an additional soak for approximately 1 minute in a nitric hydrofluoric acid solution maintained at room temperature to remove all traces of flux particles (see 5.8.1.2.2a) and rinsed (see 5.8.1.2.2b).
5.9 Dry air piping connection. For waveguide sections requiring the addition of fittings for dry air pressurization and purging, see figure 40 for details of construction and location. The inside of the waveguide should be inspected following completion of fitting assembly; the surface should be smooth, free of burrs, and distortion.
5.9.1 Air connection completion. These air connections should be completed before final assembly of waveguide.
5.10. FINISHING OPERATION
5.10.1 Finishing operation. The finishing operation as required will be performed in the following order: machining, smoothing, cleaning, and sealing/painting.
5.10.1.1 Machining. Following brazing, machining, such as broaching may be necessary to obtain desired configuration.
5.10.1.2 Smoothing. The surface finish of the inside of the waveguide should be sanded smooth, if necessary, by carefully using fine emery paper or crocus cloth. The average interior surface roughness should be measured in accordance with ASME B46.1 and should conform to the specified requirement. Flaws should not be included in the surface roughness. When measured, as specified above, the average interior surface roughness of the waveguide should not exceed the values shown in table II, except the corner radius need not be included in the measurement.
5.10.2 Cleaning waveguide. When fabrication is completed, each waveguide section must be carefully cleaned
(see 5.4).
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