MIL-DTL-22641F
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Adapters covered by this specification are intended for use in the microwave region of the
electromagnetic frequency spectrum.
6.2 Acquisition requirements. Acquisition documents must specify the following:
(a) Title, number, and date of this specification.
(b) Title, number, and date of the applicable specification sheet, and the complete part number (see 3.1
and 1.3).
(c) If required, the specific issue of individual documents referenced (see 2.2.1 and 2.3).
(d) First Article Testing Requirements (see 3.1.1, 4.4 and 6.4).
(e) Packaging requirements (see 5.1).
6.3 Subject term (key word) listing.
Connectors
Dissimilar metals
Flange
Insertion loss
Mating
Microwave
Radio frequency (RF)
Series N
Series SMA
Series TNC
Soldering
VSWR
6.4 First article inspection and approval. Information pertaining to first article inspection and approval of products
covered by this specification should be obtained from the acquiring activity.
6.5 Definitions. For the purpose of this specification, the following definition applies:
6.5.1 Dissimilar metals. Dissimilar metals are defined in MIL-STD-889.
6.5 Engineering information. Illustrations and additional engineering information for currently available adapters
are included in MIL-HDBK-216, RF Transmission Lines and Fittings.
6.6 Environmentally preferable material. Environmentally preferable materials should be used to the maximum
extent possible to meet the requirements of this specification. As of the dating of this document, the U.S.
Environmentally Protection Agency (EPA) is focusing efforts on reducing 31 priority chemicals. The list of chemicals
and additional information is available on their website at https://www.epa.gov/osw/hazard/wastemin/priority.htm.
Included in the list of 31 priority chemicals are cadmium, lead, and mercury. Use of the materials on the list should
be minimized or eliminated unless needed to meet the requirements specified herein (see section 3).
6.7 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin
whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture
and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied
over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,
have shown to inhibit the growth of tin whiskers (see 3.2.11). For additional information on this matter, refer to
ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin).
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